TECHNOLOGY

Process Capability

Capabilities for Rigid Board and HDI
Layer Count	0-40 layers	Material Type	FR-4,High-frequency Material High-Speed Material
Finished Board Size	≤24inch*48inch	Material Brand	ITEQ,Shengyi,TUC,NANYA,MATSUSHITA,Isola,Nelco,Rogers,Taconic,Arlon and so on
Finished Board Thickness	0.2mm-8.0mm	The Tolerance of Board Thickness	Normal Tolerance：±0.1mm(board thickness≤1.0mm),±10%(board thickness＞1.0mm)； Special Tolerance：±0.1mm(≤2.0mm),±0.15mm(2.1-3.0mm)
Surface Treatment	ENIG, Hard gold、Flash gold, HASL, HASL Lead free, OSP, ENEPIG, Soft gold, Immersion silver, Immersion Tin, ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finge, Flash gold(electroplated gold)
DrilIing Diameter & Copper Thickness
Minimun Hole Diameter	4mil	Copper Thickness for Inner Layers	0.5 OZ-6 OZ
Laser Hole Diameter	4mil-6mil	Hole Dia. Tolerance(PTH)	±2mil
Copper Thickness for Outer Layers	0.33OZ-6OZ	Hole Dia. Tolerance(NPTH)	±2mil
Trace(line) & Solder Mask
The minimum Line Width and Line Spacing	3/3mil	The Minimum SM Window Size	1mil
Accuracy Degree of Special Impedance	Normal Tolerance：±3Ω(<30Ω),±10%(≥30Ω)； Special Tolerance：±3Ω(<30Ω),±5%（≥60Ω），±7%（≥45Ω））	SM Place Alignment Tolerance	±2mil
SM Bridge Width	≥3mil	The Hardness of SM	≥6H
SM Color	Green、Matt Green、Blue、Matt Blue、Black、Matt Black、Yellow、Red、White
CNC & Test
Outline Tolerance	±0.1mm	Board Twist	The maximum 0.75%
Fire Resistance	94V-0

Capabilities for Rigid Board
Layers	1-8Layers	Maximum Panel Size	19.6*31.0 inch
Maximum Single Unit Size	9inch14inch （limitation is 9inch23inch）	Minimum Panel Size	9.0*12.0 inch
Board Size Tolerance	±0.1mm	Maximum Finished Board Thickness	0.80mm
Minimum Finished Board Thickness	0.05mm
Trace/Line
Minimum Line Width for Inner Layers	3mil	Minimum Line Spacing for Outer Layers	3.5mil
Minimum Line Width for Outer Layers	3mil	The Copper Thickness for Inner Layers	≤2OZ
Minimum Line Spacing for Inner	3mil	The Copper Thickness for Inner Layers	≤3OZ
Drilling
Minimum Hole Diameter	0.15mm	Minimum Distance from Hole to Board Outline	8mil
Maximum Hole Diameter	6.4mm	Minimum Size for Hole Ring	4mil（Partially 3.2mil）
Hole Diameter Tolerance	±2mil	The Minimum BGA Bonding Pad Design	≥8mil (7mil is the Limitation)
The Distance from Hole to Hole	10mil	The Minimum SMT Design	≥7mil
Solder Mask
SM Bridge Width	≥4mil	Minimum Width of Legend	4mil
Minimum Size of SM Window	3mil（Partially 2.5mil）	Minimum Hight of Legend	23mil
The Minimum Distance from SM Window to Other Outline	3mil
Surface Finished
HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F
Impedance
Whether it is capable of impedance testing	Yes, it capable, it have

Capabilities for Rigid-Flexible Board
Rigid-Flexible Structure	1+N+1HDI、2+N+2HDI，3+N+3HDI；Fly-tailed Rigid-flex Board（≤20 Layers）
Raw Material
The Material for Flexible Boart Section	SF305、RF-775、Dupont AP(杜邦 AP)
The Material for Rigid Boart Section	IT-180A、S1000-2、 TU-768（TU-752）、 85N、RO4350B Series、VT-901、R-5775、TU-872SLK、TU-862HF
Stiffener Material	PI
Coverlay	SF305C Series、FHK Series、FR Series
Color
Rigid Board Section	Green、Red、Blue、Black、White
Flexible Board Section	Green、Red、Blue、Black、White
Layer Count
Rigid Board Section	2-20 Layers
Flexible Board Section	1-8 Layers
Board Thickness
Rigid Board Section	0.3mm-4.0mm
Flexible Board Section	0.05mm-0.80mm
Size/Dimension
Maximum Unit Size	16inch*29inch
Minimum Unit Size	10mm*15mm
Size/Dimension Tolerance
Rigid Board Section	±4mil
Flexible Board Section	±4mil
Copper Thickness (The Maximum Copper Thickness)
Copper Thickness for Inner Layers	≤2OZ
Copper Thickness for Outer Layers	≤3OZ
Surface Treatment/Finish
Without Lead	HASL Lead Free、ENIG、ENEPIG、Flash Gold、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F、Whole Board Gold Plating+G/F
With Lead	HASL

Capabilities for PCB Layout
Maximum signal design rate	28Gbps
Maximum design layer	40L
Minimum BGA pitch	0.4mm
Minimum aperture	4mil
Maximum number of Connections	3000
Maximum number of pins	60000
Minimum design line width	3/3mil
Maximum BGA pin number	2597

Capabilities for PCB Assembly
Stencil size Range	29inch*29inch
SMT	Position accuracy : 25um
	components size: 0201--150mm
	Max.PCB Size: 680mm*500mm
	Min.PCB size:50mm*50mm
	Min.PCB Thickness: 0.3mm-- 6mm
	Min.IC Pitch: 0.30mm
wave-Solder	Max.PCB width: 450mm
	Min.PCB width: no Limited
	Component height: Top 120mm/Bottom 15mm
Min. BGA pitch	0.008"
Max.BGA Size	74mm x74mm
BGA Ball Pitch	1.00mm (Min); 3.00mm (Max)
BGA Ball Diameter	0.40mm (Min); 1.00mm (Max)
QFP Lead Pitch	0.38mm (Min); 2.54mm (Max)
Testing	×-Ray ,AOI,Microscope to 20x,
Testing	ICT,Function test,Temperature cycling
Frequency of Stencil Cleaning	1 time / 5 ~ 10 pieces

Bruce LIU

aimee51862

Address of Plant

Factory 1:

Build I and Building D,Second Industrial Park, Caowei Community, Xixiang Street,Baoan District, Shenzhen, China.

Factory 2:

No.19, Hexie Road, High-Tech Industrial Park, lipu, Guilin City, Guangxi Provice, China.

Office Address:

Office 515-516, Tower B, Western Silicon Vally, Hangcheng Street, Baoan District, Shenzhen, China.

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